Big Size Hot Air Reflow Oven With 12 Heating Zones PCB Soldering Machine
Reflow Oven Features:
1. Reflow Oven is optimized design and advanced technology, excellent and precise manufacturing;
2. Advanced technology application and creation to reassure the best machine performance;
3. Adhering to the rigorous and pragmatic tradition of equipment manufacturing, the machine is durable with good reputation and low failure rate;
4. The most efficient heating and conduction, allows ΔT control inside the chamber to be ±1℃
5. The exclusive patented flux collection system makes the chamber clean, reduce maintenance time and cost;
Intelligent nitrogen monitoring and control system and valve control, according to the oxygen content in the chamber, automatically adjust valve opening ratio (from 0---100%) to ensure the chamber stability, also to save the nitrogen consumption to maximum. Our nitrogen consumption is only 50% of other competitors, helping customers to control the production cost of nitrogen consumption;
6. High performance and durable seals are used, advanced design ensures good air tightness, the oven achieves a minimum of 20 PPM oxygen content, and keep the set values very well;
7. User-friendly operation interface, advanced touch screen technology; using USB to secure installation, software backup, easy to operate. Program backup, restore, data import& export, save all the time information of the software system to facilitate engineers to track and share any anomalies; there is an optional MES system for easy tracking the situation of the products in the oven (widely used in automotive and other important industry);
8. Automatic switch on/off function, convenient for operators to save time, especially for one-shift production (for example, setting the automatic startup at 7:00 a.m. on Monday morning and 6:00 p.m. automatic shutdown);
9. Wide range of applications for all SMT production soldering processes. Preheating zone can be set to a maximum of 300-350 ℃, vacuum zone can be set to a maximum of 300 ℃.
10. Patented in-line vacuum system, can reduce void rate by 99%. The standard width of vacuum chamber is 510
Reflow Oven SPECIFICATION
| Model | ZM-KT100 |
| Weight | Apprx:2500KG |
| Dimension | 6025×1350×1500mm |
| Heating zone qty. | Top10/ bottom 10 |
| Cooling zone qty. | Top 4/ bottom 4 |
| Cooling way | Forced water cooling |
| Rectifying plate structure | Carbon heating plate |
| Exhausting requirement | 10㎡/min×2 |
| Control system |
| Power supply | 3P 380V 50/60HZ |
| Total power | 54KW |
| Startup power | 38KW |
| Consumption power | 12KW |
| Speed adjusting | 3 sections with 3 inverters |
| Warm up time | Apprx.20minute |
| Temp. control range | Room temp.～300℃ (adjustable) |
| Temp. control accuracy | ±1℃ |
| PCB temp. deviation | ±1.5℃ |
| Data store | Can store unlimited setting parameters |
| Abnormal alarm | High temp., low temp., conveying, vacuum pressure, nitrogen, air volume, PCB entering abnormal |
| Conveying system |
| Rail structure | Separately controlled in 3 sections |
| PCB max. width | 400mm*350mm |
| Conveyor height | 900±200MM |
| Conveying way | Chain |
| Vacuum system |
| Vacuum min. pressure | －0 .1MP |
| Vacuum pump power | 3KW rotary vane wet |
| Vacuum pressure relief time | ≦10S |
| Vacuuming time | 10-300S |
| Vacuum chamber open way | Electric |
| Vacuum chamber size | 500*400*300mm |
| Production beat | ≧20S |
| Nitrogen system (option) |
| Nitrogen period | The whole production time |
| Nitrogen concentration | 500-1000PPM |
| Nitrogen consumption | 15-30m³ |
Product Tags:
|
|
Single Step Pumping SMT Vacuum Reflow Oven For BGA Soldering Images
|
